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PIC design & Application Engineer

SMART Photonics - Eindhoven
desired DfX ( Design for Manufacurability, Test, Packageability, Reliability) targets. Advice internal functions and customers on how to best consume PIC technology and ultimately accelerate time-to-market Translate customer
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Digital Design Engineer

TMC - Eindhoven
front-end chip and currently an FPGA. We are looking for support to design the FPGA sub-system. Though the RTL is currently used only in FPGA, it should be suitable for ASIC too. So, the use of FPGA-specific IPs is NOT
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Mechanical Design Engineer

TMC - Eindhoven
mechanische ontwerp tot aan de detail engineering? We’d love to hear from you. | JOUW UITDAGINGENAls Mechanical Design Engineer bij TMC ben je verantwoordelijk voor het mechanisch ontwerp tot detailengineering, voor een grote variatie
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